| Hybrid | Phi side | module id | problem channels | noise map
| |||
| Z side | module id | problem channels | noise map | ||||
| Wafer | Phi side | module id | Operation Voltage | Igr,Vdep | problem channels | resistance map | capacitance map |
| Z side | module id | Operation Voltage | Igr,Vdep | problem channels | resistance map | capacitance map |
|
| Assembling | Effective dimensions | Gluing problems | |||||
| Bonding | shorted and/or disconnected channels | Bonding problems | |||||
| Performance | ![]() Pedestal map |
![]() noise map |
![]() S/N distribution | Dead/noisy channels |